Heat Sinks

2,858 parts by stock depth · page 1 of 15

Heat Sinks in the Catalogue section, sorted by the deepest stock at the distributors that carry them.

TracedParts lists 2,858 heat sinks from 70 manufacturers. Prices, stock and lead time come from DigiKey, Mouser and element14 through their own APIs, pulled 2026-11-10. The 200 shown on this page hold 1,846,716 units between them, cheapest unit price from RM 0.52.

Which heat sinks are in stock, and what do they cost?

PART NUMBER

MANUFACTURER

DESCRIPTION

PACKAGE

TOTAL STOCK

FROM

MS 53 3

FISCHER ELEKTRONIK

FISCHER ELEKTRONIK - MS 53 3 - Mounting Pad, Transistor, Round, Glass Reinforced Polyamide, TO-5, 9.4 mm, 205°C Max Temp

BOYD - MAX08NG - HEATSINK CLIP, TO218/TO247/TO247J

FISCHER ELEKTRONIK - MS 56 15 - Mounting Pad, Transistor, Round, Glass Reinforced Polyamide, TO-5 6P, 9.5 mm, 205°C Max Temp

BOYD - 4180G - Thermal Insulator, Aluminium Oxide Ceramic, 15.06 W/m.K, 2.03 mm

BOYD - 577202B00000G - Heat Sink, Square, PCB, 24.4 °C/W, TO-220, 13.21 mm, 12.7 mm, 19.05 mm

BOYD - MAX07NG - HEATSINK CLIP, 12MM, TO-220

BOYD - MAX01NG - Heat Sink Clip, Aavid Thermalloy Max Clip Extrusion Profiles, 14.7 mm x 10 mm

VISHAY - THJP0603AST1 - Thermal Jumper, THJP Series, Aluminium Nitride, 14°C/W, 0603

BOYD - MAX03NG - Heat Sink Clip, Aavid Thermalloy Max Clip Extrusion Profiles, 14.7 mm x 15 mm

WAKEFIELD THERMAL - 103 - SEMICONDUCTOR HARDWARE, INSULATORS

BOYD - 574502B00000G - HEAT SINK

BOYD - CLP-212G - Heat Sink Clip, TO-220 Packages, 18.9 mm x 10 mm

WAKEFIELD THERMAL - 175-6-220P - SEMICONDUCTOR HARDWARE, INSULATORS

WAKEFIELD THERMAL - 217-36CTRE6 - Heat Sink, Square, PCB, Surface Mount, 55 °C/W, SOL-20, SOT-223, TO-220, TO-263, 15.2 mm, 9.14 mm

MULTICOMP PRO - MC33278 - Heat Sink, 7.6 °C/W, TO-220, 42 mm, 20 mm, 38 mm

BOYD - 4880SG - MOUNTING KIT

MULTICOMP PRO - 31-35-25GFN - Thermal Insulator Bush, Nylon, TO-220, Pack of 10

WAKEFIELD THERMAL - LTN20069 - HEAT SINK, ALUMINIUM, 16.5MM

BOYD - 507302B00000G - Heat Sink, Square, PCB, 24 °C/W, TO-220, 19.05 mm, 9.67 mm, 19.05 mm

WAKEFIELD THERMAL - 274-2AB - Heat Sink, Square, PCB, 50 °C/W, TO-220, 13.2 mm, 12.7 mm, 19.1 mm

BOYD - 4880G - MOUNTING KIT

BOYD - MAX10NG - Heat Sink Clip, Aavid Thermalloy Max Clip Extrusion Profiles, 19.7 mm x 12 mm

WAKEFIELD THERMAL - CD-02-05-247 - PHASE CHANGE THERMAL MATERIAL, TO247

BOYD - 4473G - Heat Sink Clip, TO-218, TO-247 Packages, 21 mm x 21 mm

MULTICOMP PRO - MK3306/TG - Thermal Insulator, Silicone Rubber, 1.6 W/m.K, 6 kV, 0.23 mm, 10 ohm-cm

WAKEFIELD THERMAL - 290-1AB - HEAT SINK

BOYD - 576802B03900G - HEAT SINK

MULTICOMP PRO - MC33282 - Heat Sink, 21 °C/W, TO-220, 12.7 mm, 19.02 mm, 12.7 mm

BOYD - 534202B02853G - HEAT SINK

WAKEFIELD THERMAL - 271-AB - HEAT SINK

BOYD - 581002B02500G - Heat Sink, TO-220/218, 17.4 °C/W, TO-220, 16.26 mm, 25.4 mm, 16.26 mm

ABL HEATSINKS - BGA-STD-020 - Heat Sink, For Ball Grid Array, Standard, 24.5 °C/W, BGA, 21 mm, 9 mm, 21 mm

WAKEFIELD THERMAL - 637-15ABPE - HEAT SINK

WAKEFIELD THERMAL - OMNI-UC - CLIP, TO-247/TO-264 HEATSINK

WAKEFIELD THERMAL - 637-10ABEP - Heat Sink, For Board Level Power Semiconductor, 5.8 °C/W, TO-220, 34.9 mm, 25.4 mm, 12.7 mm

FISCHER ELEKTRONIK - ICK SMD A 5 SA - Heat Sink, 123 K/W, SOIC-8, SOIC-14, SSOP-16, TSSOP-14, TSSOP-16, 6.3 mm, 4.8 mm, 5 mm

WAKEFIELD THERMAL - CD-02-05-247-N - PHASE CHANGE PAD, TO247, 24.13 X 19.1MM

BOYD - 529802B02500G - HEAT SINK

BOYD - 530002B02500G - Heat Sink, Square, PCB, With Radial Fins, 2.6 °C/W, TO-220, 41.91 mm, 63.5 mm, 25.4 mm

WAKEFIELD THERMAL - 637-10ABPE - HEAT SINK

BOYD - 4171G - INSULATOR, ALUM OXIDE CERAMIC, TO-220

BOYD - 53-77-9G - THERMAL PAD, 18.42X13.21MM, TO-220

BOYD - SW25-4G - Heat Sink, 13 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 25 mm, 12.5 mm

WAKEFIELD THERMAL - 274-1AB - Heat Sink, Square, PCB, 56 °C/W, TO-220, 13.2 mm, 9.5 mm, 19.1 mm

BOYD - 43-77-9G - THERMAL INSULATING FILM

10,229

RM 4.35

ATS-PCB1025.

ADVANCED THERMAL SOLUTIONS

ADVANCED THERMAL SOLUTIONS - ATS-PCB1025. - HEAT SINK, 11DEG C/W, 0.56"X0.62"X0.37"

10,000

RM 5.90

ATS-PCB1073.

ADVANCED THERMAL SOLUTIONS

ADVANCED THERMAL SOLUTIONS - ATS-PCB1073. - HEAT SINK, 5DEG C/W, 0.5"X1.03"X0.4"

WAKEFIELD THERMAL - 634-10ABPE - HEAT SINK

WAKEFIELD THERMAL - 175-6-240P - SEMICONDUCTOR HARDWARE, INSULATORS

BOYD - SW38-4G - Heat Sink, 10 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 38 mm, 12.5 mm

VISHAY - THJP2512AST1 - Thermal Jumper, THJP Series, Aluminium Nitride, 15°C/W, 2512

BOYD - 4525 - Heat Sink Clip, TO-220 Packages, 19 mm x 9 mm

BOYD - 577002B00000G - Heat Sink, 32 °C/W, TO-220, 13.21 mm, 6.35 mm, 19.05 mm

FISCHER ELEKTRONIK - SKK 56 TO 5 - Heat Sink, PCB, For Semiconductor, TO-5, 63 °C/W, TO-5, 9 mm, 12.7 mm

BOYD - 7106DG - Heat Sink, Square, PCB, Surface Mount, 15 °C/W, TO-263, 25.91 mm, 9.52 mm, 14.99 mm

FISCHER ELEKTRONIK - ICK 40 B - Heat Sink, DIP, Glue-On, 8.5 °C/W, DIP, 19 mm, 4.8 mm, 51 mm

FISCHER ELEKTRONIK - ICK 24 B - Heat Sink, DIP, Glue-On, 13 °C/W, DIP, 19 mm, 4.8 mm, 33 mm

BOYD - 6099BG - Heat Sink, TO-220/202, 11 °C/W, TO-202, TO-220, 34.92 mm, 38.1 mm, 12.8 mm

BOYD - 577102B00000G - Heat Sink, Square, PCB, 25.9 °C/W, TO-220, 13.21 mm, 9.52 mm, 19.05 mm

BOYD - 507002B00000G - Heat Sink, 15.6 °C/W, TO-220, 44.45 mm, 9.52 mm, 17.78 mm

BOYD - 53-77-2G - INSULATOR

BOYD - 576802B00000G - Heat Sink, 27.3 °C/W, TO-220, 12.7 mm, 12.7 mm, 19.05 mm

7,520

RM 13.15

FK 244 08 D2 PAK D2PAK (TO-263)..

FISCHER ELEKTRONIK

FISCHER ELEKTRONIK - FK 244 08 D2 PAK D2PAK (TO-263).. - Heat Sink, 29.3 °C/W, TO-263, 8 mm, 10 mm, 17.8 mm

BOYD - PF436G - Heat Sink, TO-220, 25 °C/W, TO-220, 12.7 mm, 13 mm, 19.5 mm

WAKEFIELD THERMAL - 173-7-220P - INSULATOR

MULTICOMP PRO - MC33293 - Heat Sink Clip

BOYD - 6025DG - HEAT SINK

BOYD - 56-77-8G - INSULATING COVER

MULTICOMP PRO - ASM-1900181-21 - Heat Sink Assembly, Aluminium, Raspberry Pi 5 Boards

FISCHER ELEKTRONIK - ICK 14 16 B - Heat Sink, 50 °C/W, DIP, 19 mm, 4.8 mm, 6.3 mm

FISCHER ELEKTRONIK - ICK 14 16 L - Heat Sink, 46 °C/W, DIP, 6.3 mm, 4.8 mm, 19 mm

WAKEFIELD THERMAL - 647-15ABPE - HEAT SINK

BOYD - 523002B00000G - Heat Sink, Square, PCB, 19 °C/W, TO-220, 25.4 mm, 12.7 mm, 30 mm

BOYD - 6022BG - HEAT SINK

BOYD - 53-77-4G - THERMAL PAD, 19.3MMX12.7MM, TO-220

ABL HEATSINKS - BGA-STD-050 - Heat Sink, For Ball Grid Array, Standard, 14 °C/W, BGA, 20 mm, 19.1 mm, 20 mm

FISCHER ELEKTRONIK - SKK 510 TO 5 - Heat Sink, PCB, For Semiconductor, TO-5, 44 °C/W, TO-5, 10 mm, 12.7 mm

BOYD - 6396BG - Heat Sink, Square, PCB, With Radial Fins, 5.6 °C/W, TO-218, TO-220, 41.91 mm, 25.4 mm, 25.4 mm

WAKEFIELD THERMAL - 217-36CTE6 - HEAT SINK

BOYD - 577500B00000G - HEAT SINK

BOYD - 7019B-MTG - HEAT SINK

VISHAY - THJP1225AST1 - Thermal Jumper, THJP Series, Aluminium Nitride, 4°C/W, 1225

BOYD - 504102B00000G - HEAT SINK

ABL HEATSINKS - PPN0500B - Heat Sink, TO-218, TO-220, 5 °C/W, TO-218, TO-220, 50 mm, 28 mm, 50 mm

BOYD - 531002B02500G - Heat Sink, Square, PCB, With Radial Fins, 13.4 °C/W, TO-220, 34.92 mm, 12.7 mm, 25.4 mm

SAME SKY - HSS15-B20-P40 - Heat Sink, 18.6 °C/W, TO-220, 23.4 mm, 12.7 mm, 38.1 mm

LAIRD - THER-T-LARGE - Thermal Insulator, Thermaflex Tube, TO-3P, Silicone Extrusion, 0.7 W/m.K, 8 kV, 0.5 mm

ABL HEATSINKS - BGA-STD-015 - Heat Sink, For Ball Grid Array, Standard, 26.5 °C/W, BGA, 14 mm, 10 mm, 14 mm

FISCHER ELEKTRONIK - ICK BGA 27 X 27 - Heat Sink, For Ball Grid Array, 20 °C/W, BGA, 27 mm, 6 mm, 27 mm

WAKEFIELD THERMAL - 270-AB - HEAT SINK

WAKEFIELD THERMAL - 274-3AB - HEAT SINK

BOYD - 6021BG. - HEAT SINK

BOYD - PF750G - Heat Sink, TO-220, 20 °C/W, TO-220, 22 mm, 19 mm, 11 mm

BOYD - 374424B00035G - Heat Sink, Square, PCB, For Ball Grid Arrays, 20.3 °C/W, BGA, 27 mm, 18 mm, 27 mm

FISCHER ELEKTRONIK - ICK BGA 10 X 10 X 10 - Heat Sink, Square, PCB, For Ball Grid Arrays, 28.5 °C/W, BGA, 10 mm, 10 mm, 10 mm

SPREADFAST - SF-CHS-191906-PC - Heat Sink, 38.7 °C/W, 19 mm, 6 mm, 19 mm

BOYD - 575200B00000G - Heat Sink, 60 °C/W, TO-92, 15.29 mm, 18.29 mm

FISCHER ELEKTRONIK - WLFT 404 14 X 14 - Thermal Conductive Foil, 0.37 W/m.K

BOYD - SW25-2G - Heat Sink, TO-220/218, 13 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 25 mm, 12.5 mm

VISHAY - THJP0612AST1 - Thermal Jumper, THJP Series, Aluminium Nitride, 4°C/W, 0612

WAKEFIELD THERMAL - 230-75AB - HEAT SINK

BOYD - 529702B02500G - HEAT SINK

BOYD - 551002B00000G - HEAT SINK

BOYD - 7109DG - Heat Sink, Square, PCB, For D-Pak Devices, 11 °C/W, TO-263, 19.38 mm, 11 mm, 25 mm

BOYD - 53-02-103G - THERMAL INSULATOR

BOYD - 573902B04000G - HEAT SINK

BOYD - 530714B00000G - HEAT SINK

FISCHER ELEKTRONIK - ICK S 14 X 14 X 10 - Heat Sink, Square, Pin, For CPU, 9.8 °C/W, Universal Processor, 14 mm, 10 mm, 14 mm

BOYD - 322400B00000G - Heat Sink, PCB, Board Level, Black Anodized, 99.99 °C/W, TO-18, 5.97 mm, 12.7 mm

FISCHER ELEKTRONIK - US 58 4 - Mounting Pad, Transistor, Square, Glass Reinforced Polyamide, TO-5, 9.9 mm, 205°C Max Temp

AMEC THERMASOL - MPC202025T - Heat Sink, Square, Micro Porous, 10.21 °C/W, 20 mm, 2.5 mm, 20 mm

WAKEFIELD THERMAL - CD-02-05-220 - PHASE CHANGE THERMAL MATERIAL, TO220

BOYD - 4597 - Heat Sink Clip, TO-218, TO-220 Packages, 21 mm x 14.5 mm

WAKEFIELD THERMAL - 655-26AB - HEAT SINK

BOYD - 7023BG - HEAT SINK

3,713

RM 115.10

SK 104 50,8 STS SOT 32

FISCHER ELEKTRONIK

FISCHER ELEKTRONIK - SK 104 50,8 STS SOT 32 - Heat Sink, TO-220, 9 °C/W, SOT-32, TO-3P, TO-220, 34.9 mm, 12.7 mm, 50.8 mm

WURTH ELEKTRONIK - 407150045015 - Thermally Conductive Material, 400 W/m.K, 45 mm L x 15 mm W x 1.5 mm T

BOYD - 504222B00000G - Heat Sink, Square, PCB, 6.4 °C/W, TO-220, 19.81 mm, 21.59 mm, 36.83 mm

SAME SKY - CP60140 - Thermoelectric Cooler Module, 0.29 ohm, 2.1 VDC, 6 A, 7.1 W, 1 Stage, 20 AWG Red & Black

BOYD - 580200B00000G - HEAT SINK

BOYD - M48079B011000G - Heat Sink, TO-126, TO-220, TO-247, 22 mm, 38.5 mm, 20.07 mm

FISCHER ELEKTRONIK - ICK SMD A 10 SA - Heat Sink, 75 °C/W, SOIC-16, SOIC-18, 6.3 mm, 4.8 mm, 10 mm

BOYD - 322505B00000G - HEAT SINK

WAKEFIELD THERMAL - 647-10-ABEP - Heat Sink, For Board Level Power Semiconductor, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm

FISCHER ELEKTRONIK - ICK PGA 6 X 6 X 14 - Heat Sink, Square, For PGA's, 18.6 °C/W, PGA, 14 mm, 14 mm, 14 mm

BOYD - 501200B00000G - HEAT SINK

BOYD - 374124B00032G - Heat Sink, Square, PCB, For Ball Grid Arrays, 23.4 °C/W, BGA, 23 mm, 18 mm, 23 mm

MULTICOMP PRO - MC33263 - Heat Sink, 13.4 °C/W, TO-220, 34.9 mm, 25.4 mm, 12.85 mm

BOYD - 6391BG - Heat Sink, TO-220/218, 12.9 °C/W, TO-218, TO-220, 16.26 mm, 38.1 mm, 16.26 mm

BOYD - 374024B00032G - Heat Sink, Square, PCB, For Ball Grid Arrays, 40 °C/W, BGA, 23 mm, 10 mm, 23 mm

WURTH ELEKTRONIK - 407200045020 - Thermally Conductive Material, 400 W/m.K, 45 mm L x 20 mm W x 2 mm T

BOYD - PF752 - Heat Sink, TO-220, 23 °C/W, TO-220, 22 mm, 19 mm, 11 mm

MULTICOMP PRO - MC33286 - Heat Sink, Square, PCB, Extruded, 10.2 °C/W, TO-220, 34.53 mm, 38 mm, 12.53 mm

BOYD - 507002B00000G. - HEAT SINK

MULTICOMP PRO - M1802D-PK100 - Transistor Pad, 6.34mm x 3.18mm, TO-18 Packages

BOYD - 6273B - HEAT SINK

WURTH ELEKTRONIK - 407150015050 - Thermally Conductive Material, 400 W/m.K, 15 mm L x 15 mm W x 5 mm T

ABL HEATSINKS - BGA-STD-010 - Heat Sink, For Ball Grid Array, Standard, 27 °C/W, BGA, 13.5 mm, 10 mm, 13 mm

WURTH ELEKTRONIK - 407150015200 - Thermally Conductive Material, 400 W/m.K, 15 mm L x 15 mm W x 20 mm T

MULTICOMP PRO - MC33269 - Heat Sink, 4.4 °C/W, TO-218, TO-220, TO-247, 42 mm, 38.1 mm, 25 mm

FISCHER ELEKTRONIK - FK 244 08 D PAK - Heat Sink, Square, PCB, For D Pak, 31.5 °C/W, TO-252, 8 mm, 10 mm, 23 mm

ABL HEATSINKS - BGA-STD-025 - Heat Sink, For Ball Grid Array, Standard, 22 °C/W, BGA, 23 mm, 6 mm, 23 mm

WAKEFIELD THERMAL - 175-6-230P - SEMICONDUCTOR HARDWARE, INSULATORS

BOYD - TV4 - Heat Sink, PCB, Board Level, 21 °C/W, TO-126, 22 mm, 19 mm, 19 mm

BOYD - 501503B00000G - Heat Sink, 8.4 °C/W, TO-3, 35.56 mm, 25.4 mm, 47.75 mm

MULTICOMP PRO - MP008453 - Heat Sink, 0.12 °C/W, 100 mm, 32 mm, 102 mm

WAKEFIELD THERMAL - 273-AB - HEAT SINK, TO-218, TO-220

WAKEFIELD THERMAL - CD-02-05-220-3 - PHASE CHANGE PAD, TO-220, 38.1 X 12.7MM

WAKEFIELD THERMAL - 173-9-240P - INSULATOR

MULTICOMP PRO - MC33277 - Heat Sink, 28 °C/W, TO-220, 19.7 mm, 20 mm, 8.1 mm

WURTH ELEKTRONIK - 407150015030 - Thermally Conductive Material, 400 W/m.K, 15 mm L x 15 mm W x 3 mm T

FISCHER ELEKTRONIK - IB 19 - Thermal Insulator, Thermoplastic

BERGQUIST - 2015-54 - Thermal Insulator, SIL-PAD 2000, Silicone Elastomer, White, 0.015" TH, TO-220

VISHAY - THJP0603ABT1 - THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K

MULTICOMP PRO - MC33268 - Heat Sink, 5.6 °C/W, TO-218, TO-220, TO-247, 42 mm, 25.4 mm, 25 mm

BOYD - 574102B00000G - HEAT SINK

BOYD - 4880MG - MOUNTING KIT

MULTICOMP PRO - MC33285 - Heat Sink, Square, PCB, Extruded, 11.4 °C/W, TO-220, 34.53 mm, 25 mm, 12.53 mm

AMEC THERMASOL - MPC101020T - Heat Sink, Square, Micro Porous Ceramic, Adhesive Tape, 10.21 °C/W, 10 mm, 2.01 mm, 10 mm

LABFACILITY - THERMOPADS (X20) - Thermopad, Thermocouples, Self Adhesive, PTFE Glass Cloth, 13 x 18 mm, pack of 20

BOYD - TV1500 - Heat Sink, Square, PCB, Twisted Fin, 14.2 °C/W, TO-126, TO-220, 30 mm, 12.7 mm, 30.2 mm

ABL HEATSINKS - BGA-STD-090 - Heat Sink, For Ball Grid Array, Standard, 10 °C/W, BGA, 40 mm, 10 mm, 23.9 mm

ABL HEATSINKS - PPN0750B - Heat Sink, TO-218, TO-220, 3.7 °C/W, TO-218, TO-220, 50 mm, 28 mm, 75 mm

WAKEFIELD THERMAL - 272-AB - HEAT SINK

MULTICOMP PRO - M414/TO3 - Transistor Pad, Transistors Case Style TO-3, 40.26 mm x 26.54 mm

BOYD - 374324B60023G - Heat Sink, Square, PCB, For Ball Grid Arrays, 30.6 °C/W, BGA, 27 mm, 10 mm, 27 mm

BOYD - 6237BG - HEAT SINK

ABL HEATSINKS - BGA-PP-015 - Heat Sink, For Ball Grid Array, Push-Pin, 10.5 °C/W, BGA, 49 mm, 10 mm, 49 mm

VISHAY - THJP0805AST1 - Thermal Jumper, THJP Series, Aluminium Nitride, 13°C/W, 0805

BOYD - 374024B00035G - Heat Sink, Square, PCB, For Ball Grid Arrays, 40 °C/W, BGA, 23 mm, 10 mm, 23 mm

ABL HEATSINKS - 510AB0500MB(TO3) - Heat Sink, 3.3 °C/W, TO-3, 65 mm, 20 mm, 50 mm

FISCHER ELEKTRONIK - SK 452 37,5 SA - Heat Sink, Square, PCB, Extruded, LED, 11 °C/W, SOT-32, TO-220, 29 mm, 25 mm, 37.5 mm

ABL HEATSINKS - 205AB0500B - Heat Sink, TO-220, TO-218, 4.9 °C/W, TO-218, TO-220, 46 mm, 33 mm, 50 mm

ABL HEATSINKS - BGA-PP-035 - Heat Sink, For Ball Grid Array, Push-Pin, 7 °C/W, BGA, 49 mm, 20 mm, 49 mm

BOYD - 374324B00035G - Heat Sink, Square, PCB, For Ball Grid Arrays, 30.6 °C/W, BGA, 27 mm, 10 mm, 27 mm

FISCHER ELEKTRONIK - ICK SMD A 13 SA - Heat Sink, 63 °C/W, SOIC-20, SOIC-24, SSOP-48, TSSOP-48, TSSOP-56, TSSOP-64, 6.3 mm, 4.8 mm

SEEED STUDIO - 110991328 - Heat Sink Kit, Aluminium, Black, Raspberry Pi 4B

BOYD - 374124B00035G - Heat Sink, Square, PCB, For Ball Grid Arrays, 23.4 °C/W, BGA, 23 mm, 18 mm, 23 mm

BOYD - 501303B00000G - HEAT SINK

MULTICOMP PRO - MC33279 - Heat Sink, 7.1 °C/W, TO-220, 42 mm, 25 mm, 38 mm

BOYD - 507222B00000G - HEAT SINK

WAKEFIELD THERMAL - 287-1ABE - HEAT SINK

SAME SKY - HSE-B20254-035H-01 - Heat Sink, 14.42 °C/W, TO-220, 25.4 mm, 12.7 mm, 35 mm

SAME SKY - CP40236 - Thermoelectric Cooler Module, 2 ohm, 8.6 VDC, 4 A, 18.7 W, 1 Stage, 20 AWG Red & Black

MULTICOMP PRO - MPGCS-020-150-1.0AA - THERMAL PAD, SILICONE, 150X1MM, BLUE

FISCHER ELEKTRONIK - ICK BGA 14 X 14 X 10 - Heat Sink, Square, PCB, For Ball Grid Arrays, 27.4 °C/W, BGA, 14 mm, 10 mm, 14 mm

BOYD - TV40G - Heat Sink, PCB, Board Level, 9.9 °C/W, TO-218, TO-220, 28 mm, 22 mm, 38 mm

FISCHER ELEKTRONIK - FK 231 SA 220 TO 220 - Heat Sink, 24 K/W, TO-220, 13.5 mm, 9.5 mm, 19.5 mm

BOYD - TV58G - Heat Sink, 30 °C/W, TO-220, 22 mm, 11 mm, 19 mm

BOYD - SW38-2G - Heat Sink, TO-220/218, 10 °C/W, TO-218, TO-220, TO-247, 34.5 mm, 38 mm, 12.5 mm

BOYD - 7173DG - HEAT SINK

1,428

RM 29.30

SK 104 38,1 STS SOT 32

FISCHER ELEKTRONIK

FISCHER ELEKTRONIK - SK 104 38,1 STS SOT 32 - Heat Sink, TO-220, 11 °C/W, SOT-32, TO-3P, TO-220, 34.9 mm, 12.7 mm, 38.1 mm

FISCHER ELEKTRONIK - ICK SMD F 8 SA - Heat Sink, 74 °C/W, PLCC-20, TQFP-32, TQFP-42, TQFP-44, TQFP-48, 8 mm, 6 mm, 8 mm

AMEC THERMASOL - MPC151525T - Heat Sink, Square, Micro Porous, 10.21 °C/W, 15 mm, 2.5 mm, 15 mm

BOYD - 576802B00000G. - Heat Sink

LAIRD - A17084-06 - Thermal Insulator, Fibreglass, 6 kV, 0.23 mm

FISCHER ELEKTRONIK - FK 237 SA 220 O - Heat Sink, Square, PCB, Clip On, 21 °C/W, TO-220, 14.5 mm, 12.7 mm, 19 mm

FISCHER ELEKTRONIK - SK 89 150 SA - Heat Sink, Standard Extruded, Black Anodized, 0.7 °C/W, 80 mm, 78.6 mm, 150 mm

MULTICOMP PRO - 3-38-32GFN - Bush, Insulated, Nylon, TO-3, 6.1 mm External Diameter, Pack of 10

ABL HEATSINKS - BGA-STD-045 - Heat Sink, For Ball Grid Array, Standard, 14.7 °C/W, BGA, 23 mm, 18 mm, 23 mm

1,331

RM 9.59

Common questions about heat sinks

How many heat sinks does TracedParts list?

2,858 part numbers from 70 manufacturers, every one of them carried by an authorized distributor. They are ordered by total stock depth, so the parts you can actually buy today come first.

What is the lowest price for heat sinks?

Unit prices in this category start at RM 0.36 at quantity one. Larger quantities reach lower price breaks, and each part page shows the lowest price a quoting distributor lists for that exact part number.

Where do the heat sinks prices and stock come from?

DigiKey, Mouser and element14, read from their own APIs and refreshed daily; this page reflects the catalogue snapshot of 2026-11-10. No broker or open-market listings appear anywhere on TracedParts.